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Shengyi Technology Co., Ltd. (SYTECH), founded in 1985, is a global core supplier of electronic circuit base materials which integrates R&D, production, sales, marketing, and technical services. After more than 30 years of development and continuous efforts of every employee, SYTECH produced more than 81 million square meters of laminate materials in 2016. According to the statistics and ranking of global rigid laminators released by Prismark, a US research institution, SYTECH has been the world’s second-largest CCL manufacturer in terms of sales volume, from 2013 to 2017.

 

SYTECH maintains the highest standards which support products that exhibit exceptional quality, performance, and reliability. SYTECH independently produces high-end electronic materials, including CCL, prepreg, insulation boards, metal-based CCL, resin-coated copper (RCC) and coverlay materials. Products are mainly used for making single and double-sided printed circuit boards as well as multilayer boards. Typical uses for our products would be in products such as in home appliances, portable and consumable electronics, automobiles, computers, aerospace, communication networking as well as other high-end electronic products. 

SYTECH’s leading products are qualified by many world-famous companies, such as Huawei, ZTE, Nokia, Bosch, Lenovo, Sony, Samsung, and Philips, forming a large competitive advantage for SYTECH. Products are exported to many countries and regions including America, Europe, Korea, Japan, and Southeast Asia.

 

Product Name   Product Description   Tg   Td CTE
S1000  Low CTE, Mid-Tg laminate Lead-free compatible FR-4.0 laminate  155  335 3.40%
S1600 CTI600 Excellent tracking resistance,CTI≥600V 135 310 4.50%
Q160 Thermal conductive FR-4.0 Good thermal conductive performance,thermal conductivity≥0.7 W/m·K 130 310 2.80%
S1000H Low CTE, Mid-Tg Material Lead-free compatible FR-4.0 155 348 2.80%
S1000-2 Low CTE, high thermal resistance, high Tg laminate Lead-free compatible FR-4.0 laminate 180 345 2.80%
S1000-2M Low CTE, High Thermal Resistance, High Tg Material Lead-free compatible FR-4.0 laminate 180 355 2.40%
S1190 High Tg, High reliability, high thermal resistance base material for high-layer count PCB Superior thermal resistance 200 350 2.3%
Q260 Thermal conductive CEM-3 Good thermal conductivity ≥1.0 W/m·K 122 -- 3.5%
ST210G Thermal conductive CEM-3,high CTI Good thermal conductivity ≥1.0 W/m·K 122 360 3.5%
S1150G Halogen-free, mid-Tg material Free of constituents such as halogen, antimony, red phosphorous, ect. No toxic gas emission and no hazardous residue during waste combustion. 155 355 2.8%

http://www.syst.com.cn/index_en.aspx