This is a standard process flow for the manufacture of double-sided printed circuit boards with a hot air solder level (HASL/HAL) finish.
Now some manufacturers may add or remove several inspection steps at key points in the process depending on the finish requested and manufacturing equipment available at their facility.
| Quote / Order Placed | |
| CAM / Planning | |
| Material Release | |
| Drill | |
| Debur (sand surface smooth, clear holes from debris) | |
| Inspection | |
| Metallization (plated through holes) | |
| Photo Image / LDI | |
| Develope | |
| Inspection | |
| Copper Plate & Solder Plate | |
| Etch | |
| Solder Strip | |
| Inspection | |
| Solder Mask | |
| Silk Screen | |
| Inspection / Cure Bake | |
| HASL (Hot Air Solder Level or HAL) | |
| Inspection | |
| Test | |
| Rout | |
| Final Inspection | |
| Shipping |